| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e0bf0928b608797b70bbc2b91c7e52e |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 |
| filingDate |
2008-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_075331e96ce471558cc137d808297094 |
| publicationDate |
2009-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200938614-A |
| titleOfInvention |
CMP slurry composition and process for planarizing copper containing surfaces provided with a diffusion barrier layer |
| abstract |
A CMP slurry composition for planarizing surfaces comprising copper and a diffusion barrier layer comprising: an abrasive, an oxidizer, a corrosion inhibitor, a monomeric polyhydroxy compound, a base, the slurry composition having a pH of from 7 to 13. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107001860-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107001860-B |
| priorityDate |
2007-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |