| abstract |
Disclosed is an alkali-developable photosensitive adhesive which exhibits adhesion to an object to be bonded even after the adhesive is patterned by exposure and development. Specifically disclosed is a photosensitive adhesive to be used in a method for producing a semiconductor device (100) which method comprises a step wherein a photosensitive adhesive (1) provided on a circuit surface of a semiconductor chip (20) is patterned by exposure and development, and a step wherein another semiconductor chip (21) is directly bonded to the patterned photosensitive adhesive (1). |