| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_64839353416a0efae363bb44eaba1235 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L39-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-303
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D175-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-63 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D7-63
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-18 |
| filingDate |
2008-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3ddaee8318297367eed9f310d82b243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c0526341d42b31515c69102f365566d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aef28fcb8a3477248fc0f0c565e6c87b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64c7d57cb794ec8ed77d76cef5db6a79 |
| publicationDate |
2009-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200938602-A |
| titleOfInvention |
Wire enamels with good adhesion to electrical leads |
| abstract |
The present invention relates to a wire enamel comprising (A) 20%-60% by weight of at least one binder (B) 40%-80% by weight of at least one organic solvent c 0%-5% by weight of auxiliaries and additives (D) 0.01%-5% by weight of adhesion promoter, to a method of coating electrical leads with the wire enamel, and also to the use of the wire enamel for coating electrical leads. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111978844-A |
| priorityDate |
2007-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |