| abstract |
The present invention discloses an apparatus for the rapid fabrication of functional printed circuit board (PCB), which fabricates the PCB in one working machine by additively producing the dielectric layers and the conductive layers of the PCB layer by layer. The fabricated PCB may contain necessary via/holes and possible electronic components. The fabrication process of this invention comprises the additive production of the dielectric layers and the conductive layers and the necessary via/holes and the possible electronic components, and their curing. The PCB so fabricated may be the multilayer single side PCB or the multilayer double side PCB. |