http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200937114-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
filingDate 2008-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_990b2989681e4d57614266513be7cfdb
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publicationDate 2009-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200937114-A
titleOfInvention Film type transfer material
abstract Disclosed is a film type photosensitive transfer material including a base film, a resin protective layer, a photosensitive resin layer and a cover film, in which the resin protective layer has adhesion of 0.005 kgf/cm<SP>2</SP> or less. When the film type photosensitive transfer material is applied on a printed circuit board, it is possible to perform an exposure process in a state in which a base film is removed, and thus an interval between a mask and a photosensitive resin layer can be narrowed in the exposure process, thereby improving the resolution of a pattern. The film type photosensitive transfer material allows the base film to be removed before the exposure process, and can be processed in sheets or can be applied to a roll-to-roll process.
priorityDate 2007-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 32.