http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200936806-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e58a7247d4c843be828cff866761ddd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1689 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2008-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08d6be8d5d16c81c4c914085c442122d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26ac83552f0606d1b866bb474d2d75d0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed7aba9cdd74b4ce7c49e5bea6fe56d0 |
| publicationDate | 2009-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200936806-A |
| titleOfInvention | Method of avoiding tin whisker due to electroless plating |
| abstract | The object of the invention is to avoid occurrence of pin holes or tin whiskers on an upper layered tin coating film while in a two-layered electroplating that forms the tin coating film on a base layer. The solution is a method of avoiding tin whiskers due to electroless plating. The method is to form a base coating film consisting of an electroless tin-silver alloy electroplating film on an object to be plated, and then form an electroless tin plating coating film on the base coating film (upper layer coating film). The thickness of the base coating film is 0.025-0.5 μm, and the total film thickness of the base and the upper coating film is 0.1-6 μm. The composition ratio of silver in the base coating film is 5-90 percent by weight, and a copper clad laminated plate is taken as the object to be plated. By forming the extremely thin base coating film, specifying the total thickness of the base and the upper coating film and the ratio of silver in the base coating film, occurence of tin whiskers and pin holes in the tin coating film of the upper layer may be avoided. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I648151-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9330804-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2829637-A4 |
| priorityDate | 2007-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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