http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200936800-A

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filingDate 2009-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_055e4330ba2ba0622e4fb56694ff1d99
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publicationDate 2009-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200936800-A
titleOfInvention Film forming method
abstract Disclosed is a film forming method wherein the surface coverage of a gate insulating film is enhanced while reducing deterioration in the electrical characteristics thereof. The film forming method comprises a step of supplying mixture gas containing an organic silane compound and oxidizing gas into a vacuum chamber (11), a step of generating high frequency pulsating power in order to supply high frequency power intermittently, and a step of forming a silicon insulating film on a substrate (S) by generating a plasma of the mixture gas using the high frequency pulsating power. The high frequency pulsating power is generated with a maximum duty ratio out of duty ratios which satisfy a target value of the surface coverage of the silicon insulating film.
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Total number of triples: 29.