| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b01607e705336d4c0de8b9ac5f932497 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-70 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2008-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e1e6a0b717f8bf05927b6999901aafb |
| publicationDate |
2009-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200936633-A |
| titleOfInvention |
Thermosetting epoxy resin composition |
| abstract |
Disclosed is a glycidyl ether epoxy resin composition which can be quickly cured at a low temperature by an aluminum chelate-based latent curing agent without using an alicyclic epoxy compound.This glycidyl ether epoxy resin composition contains an aluminum chelate-based curing agent, a silanol compound represented by the formula (A) below, and a glycidyl ether epoxy resin. (Ar)mSi(OH)n (A) In the formula, m is 2 or 3, and the sum of m and n is 4; and Ar represents an aryl group such as a phenyl group which may be substituted. Examples of the silanol compound represented by the formula (A) may include triphenylsilanol and diphenylsilanol. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I513727-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11773208-B2 |
| priorityDate |
2008-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |