| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5e4c48663fb899e6ce58f22de5af1d2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0376
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0347
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-246 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-14 |
| filingDate |
2008-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb94ba87a9cb50cd6f11d1d5ddae4287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00d412e05ba9b4d2e4610a52b23bc393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7256cefd9f174c7108ac3aa6975d97eb |
| publicationDate |
2009-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200934325-A |
| titleOfInvention |
Method for forming circuit |
| abstract |
Disclosed is a method for forming a circuit, wherein a circuit pattern making a conductive layer (2L) is formed on an insulating resin (11) making a first insulating layer (1L), an insulating resin (13) making a second insulating layer (3L) is formed on the insulating resin (11) on which the circuit pattern is formed, a trench (14) is formed in the insulating resin (13) for exposing the circuit pattern, and the thus-formed trench (14) is filled with an electroless plating metal (15) by electroless plating. |
| priorityDate |
2007-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |