http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200930757-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d3f3715de490e1bb21776ddfd16835f6 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2021-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-16 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-16 |
| filingDate | 2008-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_516b8fc4acb84dde7d2c922d6c06950e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75362b34c527d32fbe8135dc2c5894ae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da2709ac5dea77c9c87d49d52186f250 |
| publicationDate | 2009-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200930757-A |
| titleOfInvention | Mold cleaning rubber compositon |
| abstract | This invention provides a mold cleaning rubber composition for removing soiling on the surface of a mold produced in a curable resin molding process. An unvulcanized rubber is used as a base material resin. The unvulcanied rubber comprises an ethylene-propylene rubber and a butadiene rubber at a mixing ratio of 90/10 to 50/50 on the basis of parts by weight. After the vulcanization curing of the unvulcanized rubber, the elongation is 80 to 800%, the tensile strength is 3 to 10 MPa, and the rubber hardness (durometer hardness) is A60 to 95. The 90% vulcanization time (proper vulcanization point) tc (90) at a mold temperature of 175 DEG C is 50 to 100 sec or 200 to 400 sec. When the mold cleaning rubber composition is used for cleaning for molds for the production of small-size packages having a large cavity depth, for example, PDIP or SOIC, and molds for the production of small packages, particularly small packages with a small number of pins, preferably, the mold cleaning rubber composition contains a release agent in addition to the unvulcanized rubber having a tc (90) value of 200 to 400 sec. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I565576-B |
| priorityDate | 2007-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 76.