| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1157
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1131 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4867
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01G3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-10 |
| filingDate |
2008-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c2f54ec90213325864b01a6ebdce6a9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6037d6ddc8e8dfe248464fdd128a88fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cdf8f9f201bc2d7a44a1f5ba1be5e11f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da92056b8203d7120a357e25a5f6fcd4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_970b72df600e66f1c7cb39bacd3849f0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f518158e1622848f45edd809694c52ce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cf504410ff77bb35e8d9e615edcbf1b |
| publicationDate |
2009-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200930186-A |
| titleOfInvention |
Method for forming copper wire pattern and copper oxide particle dispersion for the method |
| abstract |
A method for forming low electric resistance copper wire pattern and a copper oxide particle dispersion for the method are provided. The method can prevent the occurrence of cracks, and use copper particle which has lower electron migration and lower cost for itself without using surface treatment agent which is needed for oxidation resistance and dispersion of copper particle. The method for forming low electric resistance copper wire pattern copper includes: a step for forming random pattern on substrate by using an dispersion in which copper particles with a surface of copper oxide is dispersed, and a step for reducing the copper oxide on the surface of copper particles to copper by using atom hydrogen, and sintering the reduced and formed copper particles with each other. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I494471-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9457406-B2 |
| priorityDate |
2007-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |