http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200927833-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a82bccd73ec28ea586ebd81bd9192cce |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-106 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
| filingDate | 2008-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9663f853b76292f51985112f0be4354e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3821203bf2846627139422025e80fb27 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2749cd569299e8ad73e82d8d2801bf11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a31e6e815f2d5560b6dc49e0d85eebb7 |
| publicationDate | 2009-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200927833-A |
| titleOfInvention | Polyimide composition, flexible wiring board and method for manufacturing flexible wiring board |
| abstract | A polyimide composition which, after alkali development, does not cause white-powder deposition on the surface even when acid cleaning is not conducted. Also provided are a flexible wiring board made with the composition and a process for producing the board. Furthermore provided are: a polyimide composition which has improved alkali developability, in particular, developability with an alkali such as sodium carbonate, and is suitable for use as a cover lay material for flexible wiring boards; a flexible wiring board made with the composition; and a process for producing the board. A hydrolyzate which generates upon alkali development after light exposure can be fixed to the polyimide by reacting the hydrolyzate with a crosslinking agent. Thus, the surface deposition of a white powder can be prevented without conducting acid cleaning after alkali development. Selection of a specific material as a component of the polyimide compound can enhance alkali solubility and imparts low elasticity and flame retardancy, which are required of a cover lay material for flexible wiring boards. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102654743-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8886106-B2 |
| priorityDate | 2007-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 111.