| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ed76131ddda07950fa9ba87fba15eeb6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-167 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00 |
| filingDate |
2007-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06f278064c82c8a2f79ba502ef22132a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfc706e850741eaa79a311aeed683342 |
| publicationDate |
2009-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200926445-A |
| titleOfInvention |
Fabricating method of photoelectric device and packaging structure thereof |
| abstract |
This invention discloses a fabrication method of photoelectric device. Firstly, a ceramic substrate is provided, a first patterned electrode layer and a second patterned electrode layer are respectively formed on the upper surface and lower surface on that ceramic substrate. Through the connection methods of solder wire or co-molten alloy, the electricity of pularity of photoelectric transistor grain is respectively connected to the first electrode layer. The surfaces of all light-emitting electric transistor grain are covered by encapsulation body for protecting that photoelectric transistor grain without being damaged by external forces or environment. Along the gap between adjacent photoelectric transistor grains, that ceramic substrate is cut to form pularity of independent packaging units. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I418742-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9076947-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8686453-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I425674-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I463704-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I513050-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113140660-A |
| priorityDate |
2007-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |