http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200926214-A

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filingDate 2008-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5fa0e6ab8e183b79f32505c71dd9397
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publicationDate 2009-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200926214-A
titleOfInvention Conductor material for electronic device and electric wire for wiring using the same
abstract Disclosed is a conductor material for electronic devices, which is composed of a copper alloy material consisting of 0.5-3.0% by mass of cobalt, 0.1-1.0% by mass of silicon and the balance of copper and unavoidable impurities. This conductor material for electronic devices may further contain 0.1-3.0% by mass of nickel, one or more elements selected from iron, silver, chromium, zirconium and titanium in an amount of 0.05-1.0% by mass in total, and one or more elements selected from 0.05-0.5% by mass of magnesium, 0.1-2.5% by mass of zinc, 0.1-2.0% by mass of tin, 0.01-0.5% by mass of manganese and 0.01-0.5% by mass of aluminum in an amount of 0.01-3.0% by mass in total.
priorityDate 2007-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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