| abstract |
It is intended to provide a radiation sensitive resin composition which can give a satisfactory pattern shape, is reduced in the amount of components dissolving in an immersion exposure liquid contacted during immersion exposure, has a large receding contact angle between a resist film and the immersion exposure liquid and can reduce development defects; and a polymer to be used for the composition. The composition contains a polymer, a resin having an acid-labile group, an acid generating agent and a solvent. The polymer contains repeating units represented by the following formulae (1) and (2). R1 and R2 each represent a hydrogen atom, a methyl group, or a trifluoromethyl group; R3 represents an alkyl group having 1 to 6 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom, or an alicyclic hydrocarbon group having 4 to 20 carbon atoms, or a derivative thereof; and Z represents a group containing a group generating an acid by photoirradiation. |