| abstract |
A sputtering target made of an Ag base alloy containing 0.6 to 10.5 atomic% Ta and 2 to 13 atomic% Cu, is characterized in that: when the sputtering surface of the sputtering target is image-analyzed, (1) the ratio of the total area of Ta particles having a circle equivalent diameter of from 10 μm or more to 50 μm or less, to the total area of all Ta particles, is 60% or more, and the average distance between the centers of gravity of Ta particles is from 10 μm or more to 50 [mu]m or less; and (2) the ratio of the total area of Cu particles having a circle equivalent diameter of from 10 μm or more to 50 μm or less, to the total area of all Cu particles, is 70% or more, and the average distance between the centers of gravity is from 60 μm or more to 120 μm or less. |