| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_352169c6bc65186420eddf6adca654bc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-15 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1824
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1689 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-365
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-54 |
| filingDate |
2007-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e7684e8ae9e7cb6d0667feb738f6ebf |
| publicationDate |
2009-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200920877-A |
| titleOfInvention |
Method for soldering magnesium alloy workpieces |
| abstract |
A method for soldering magnesium alloy workpieces includes two novel techniques: the first technique is to modify the magnesium alloy surface and to perform an electroless nickel plating process, the second technique is to prepare a specific solder flux so as to work with several lead-free tin alloy solders. The aforementioned soldering method has the steps of firstly performing a mid-phosphorus (3 to 7 % of phosphorus content) electroless nickel plating process on the surface of the magnesium alloy workpieces, then performing a high-phosphorus (7 to 12 % of phosphorus content) electroless nickel plating process, and finally performing a tin soldering process. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I419758-B |
| priorityDate |
2007-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |