http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200912533-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
| filingDate | 2008-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_664d930b4febae98bd41e6b9e1f6b8da http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4d596d86577182a20542357bc8211e0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ae233ec4f9cff125dc4a41ddcd5aa4e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da1ac94bd4b2a0f0956ed03d835a39ac |
| publicationDate | 2009-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200912533-A |
| titleOfInvention | Light sensitive resin composition and flexible printed circuit board produced with the same |
| abstract | The invention provides photosensitive resin compositions and a flexible circuit board obtained using the same. The photosensitive resin compositions for the flexible circuit board is free from halogen and has little environmental load, which can give play to sufficient fire resistance and excellent flexibility of the condensates thereof. The photosensitive resin compositions comprise (A) carboxyl-containing resin, (B) phosphorus-containing acrylic ester, (C) photopolymerization initiator. The photopolymerization initiator is preferably proxetil photopolymerization initiator, which is in particularly at least one selected from the proxetil photopolymerization initiator, aminoacetophenone photopolymerization initiator (C2) and acyl phosphine oxide photopolymerization initiator (C3). The (A) carboxyl-containing resin is preferably the resin having structures of bisphenol A skeleton, bisphenol F skeleton, biphenyl skeleton, dixylenol skeleton or hydrogenation skeleton thereof, particularly preferably the resin having urethane structure or the resin having two unsaturated double-bonds with free radical polymerization. The compositions further preferably comprise (D) thermo-curing components. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104428322-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104428322-A |
| priorityDate | 2007-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 309.