http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200909999-A

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filingDate 2005-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e964adfd8c8214215d27348b7a4030a3
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publicationDate 2009-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200909999-A
titleOfInvention Photomask blank, photomask manufacturing method and semiconductor device manufacturing method
abstract A dry etching time is shortened and a resist film reduction is reduced by increasing the dry etching speed of a light shielding film. As a result, thinning (300 nm or less) of the resist film can be performed, and pattern resolution and pattern accuracy (CD accuracy) can be improved. Furthermore, a photomask blank by which a light shielding film pattern having an excellent cross sectional shape can be formed by shortening the dry etching time, and a photomask manufacturing method are provided. The photomask blank having the light shielding film on a light transmitting board is a mask blank for dry etching process, which is applicable to the photomask manufacturing method for patterning the light shielding film by dry etching process wherein a resist pattern formed on the light shielding film is used as a mask. The light shielding film is composed of a material having a selectivity to the resist over 1 in the dry etching process.
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Total number of triples: 29.