| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33dafb5bbc2ec47ebcb7becbbe60f704 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-6674
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-4833
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-4854
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-4238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-3212 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2008-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d69d4bb1ef41516c78d965f909c850d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6ffc0c870d6f86a0bfc04a26b8127e0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eff941ddc8883bac0bc1266ef5ddf334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ffb1b26ef132509b7975ab3d298afb8 |
| publicationDate |
2009-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200908119-A |
| titleOfInvention |
Polishing pad for metallic film and polishing method of metallic film using the same |
| abstract |
The present invention provides a polishing pad which is capable of achieving improvement of leveling efficiency and leveling of the polished surface while a metallic film formed on semiconductor substrate is polished; and the present invention provides a polishing method of metallic film using the said polishing pad. A polishing pad for metallic film has a storage modulus of 200 to 900 MPa at 80DEG C and a storage modulus of 40 MPa or less at 110DEG C, and a polishing method of metallic film uses the said pad. |
| priorityDate |
2007-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |