| abstract |
The present invention provides a photosensitive resin composition which is not only free from halogen-containing compounds and an antimony compound liable to adversely affect the environment and exhibits good flame retardancy after curing but also satisfies bending resistance and insulating reliability which is strict demanded in recent years. More specifically, the photosensitive resin compositions each comprise (A) a (meth)acrylate compound represented by formula (1), (B) a polyimide precursor and (C) a photopolymerization initiator, Wherein R1 represents a hydrogen atom or methyl group, R2 represent a hydrogen atom or one valence organic group, n and m both represent integers between 1-5. p is an integer between 0-6, q and r both represent integers between 0-4, and s is an integer between 0-6. The sum of p, q, r and s is 6. The sum of p and s can be 3-6, more preferably 6. |