http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200905821-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ecceccb13c44187a9d55e0144cc7559a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-642 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1305 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32188 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 |
| filingDate | 2007-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f0d4e5d73200f7a8971a8726d4f382a |
| publicationDate | 2009-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200905821-A |
| titleOfInvention | Semiconductor device and method for manufacturing the same |
| abstract | A semiconductor device and a method for manufacturing the same are described. The semiconductor device comprises: a heat sink having ate least one open passing through the heat sink; at least one semiconductor chip correspondingly disposed in the open of the heat sink, wherein the semiconductor chip includes a first side and a second side on opposite sides; an electric conduction thin film filling in a first depth portion of the open of the heat sink, wherein the second side of the semiconductor chip is embedded in the electric conduction thin film; a heat conduction thick film filling in a second depth portion of the open of the heat sink, wherein the electric conduction thin film is directly connected with the heat conduction thick film; at least one wire electrically connecting the semiconductor chip and an external circuit; and an encapsulant covering a portion of the heat sink, the semiconductor chip, the wire and an exposed portion of the electric conduction thin film. |
| priorityDate | 2007-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.