| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aea8583efc4aa4e2a9706d789804d37b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-346 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D99-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate |
2007-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa3cc732d3fcc25dc84a5b98aa2bdc20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f0f4f03afc7eb0292e5a8c6b778a172
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a96b091f80b5b4f0fea96f9df0d6324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fc9d1180a1f18d94633cbc8f0d8249e |
| publicationDate |
2009-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200905738-A |
| titleOfInvention |
Pad and method for chemical mechanical polishing |
| abstract |
A method for chemical-mechanical polishing two adjacent structures of a semiconductor device is provided. The method for mechanical polishing comprising: (a) providing a semiconductor device comprising a recess formed in a surface thereof, a first layer formed over the surface, and a second layer filled with the recess and formed on the first layer; and (b) substantially polishing the first and second layer with a pad and a substantially inhibitor-free slurry, wherein the pad comprising a corrosion inhibitor of the second layer. |
| priorityDate |
2007-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |