http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200904283-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31692 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31703 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0786 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0769 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-266 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-09 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| filingDate | 2008-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1c3a7380881df3d249afad952be30da http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0725be6460f83154ffb1894902e3aea9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e63d8344f3180bf354de012373aa4ba |
| publicationDate | 2009-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200904283-A |
| titleOfInvention | Film for metal film transfer, method for transferring metal film, and method for manufacturing circuit board |
| abstract | Disclosed is a film for metal film transfer, which has excellent transferability of a metal film layer. Also disclosed is a method for efficiently manufacturing a circuit board by using such a film for metal film transfer. Specifically disclosed is a film for metal film transfer, which is characterized by having a support layer, a release layer formed on the support layer from one or more water-soluble polymers selected from the group consisting of water-soluble cellulose resins, water-soluble polyester resins and water-soluble acrylic resins, and a metal film layer formed on the release layer.; Also specifically disclosed is a method for manufacturing a circuit board, which comprises a step for arranging the film for metal film transfer on a curable resin composition layer on a substrate in such a manner that the metal film layer is in contact with the surface of the curable resin composition layer and curing the curable resin composition layer; a step for separating the support layer; and a step for dissolving and removing the release layer present on the metal film layer by using an aqueous solution. |
| priorityDate | 2007-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 128.