| abstract |
To provide a radiation-sensitive resin composition having high radiation sensitivity, having such a development margin that even if developing time exceeds the optimum time in a development step, a good pattern profile can be formed, and capable of easily forming a patterned thin film excellent in adhesion. The radiation-sensitive resin composition includes [A] a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, (a2) an unsaturated compound containing an epoxy group and/or an oxetanyl group and (a3) an unsaturated compound other than the components (a1) and (a2), [B] a 1,2-quinonediazide compound and [C] a siloxane oligomer containing a functional group which takes part in a crosslinking reaction with the component [A] under heat. |