| abstract |
A photosensitive resin composition, a method of forming patterned cured film by using the photosensitive resin composition, and electronic component are provided. The photosensitive resin composition includes (a) polybenzoxazole precursor having a repeating unit represented by general formula (I), (b) photosensitizer, c solvent abd (d) crosslinking agent that causes a cross-linking or polymerizing by heating. In the formula, U or V represents bivalent organic group; at least one of U and V is a group having 1 to 30C aliphatic chain structure. |