http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200902580-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c6ca8a1fe5d67ba3408a3d6a3c908001 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3254 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
filingDate | 2008-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6602b2bc1350407a09e6e6a46e07b01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46468e8e962075e04bb2452e71825123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1a791dfc08f9c0510ad89fbfee80067 |
publicationDate | 2009-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-200902580-A |
titleOfInvention | Novel phosphorus-containing epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition |
abstract | Disclosed is a novel phosphorus-containing epoxy resin having a naphthalene skeleton represented by the following general formula (1). In the formula (1), a is 1, 2, 3, 4, 5 or 6; b is 1, 2, 3, 4, 5, 6 or 7; c is 0, 1, 2, 3 or more; (X) represents benzene, naphthalene, anthracene, phenanthrene or biphenyl; and (Y) represents, for example, a group represented by the following general formula (3). (3) In the formula (3), d is 0 or 1; and R1 and R2 represent a straight chain, branched or cyclic hydrocarbon group, or alternatively, R1 and R2 may combine together to form a ring structure. This epoxy resin is suitable for an insulating material such as a copper-clad laminate used in an electronic circuit board and a sealing material, molding material, casting material, adhesive or film material used in an electronic component.; Furthermore, this epoxy resin is suitable as a material for an electrically insulating coating. |
priorityDate | 2007-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.