http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200900521-A

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filingDate 2008-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7a25d2a8c76e240f36fdea0bc0fe771
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publicationDate 2009-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200900521-A
titleOfInvention Sputtering target and manufacturing method thereof
abstract The present invention provides sputtering targets capable of significantly increasing stability in early stage and reducing arcing in medium stage and late stage of sputtering, which can be manufactured in low cost. The present invention also provides manufacturing methods of the sputtering target and sputtering methods. The present invention provides a sputtering target which is used in sputtering and has deposited substance deposited onto a non-erosion portion, wherein said deposited substance is deposited in good crystallinity at least to a layer proximate to interface. Moreover, the present invention provides a sputtering target which is used in sputtering and has deposited substance deposited onto a non-erosion portion substantially without voids existing between the deposited substance and a sputter surface after an energy of 50Wh/cm<SP>2</SP> or more has been inputted, and moreover, a water-absorbing layer is provided on the sputter surface of the target.
priorityDate 2007-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 26.