| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10674
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-305
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10977
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate |
2008-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5636798c7e4ae8399312841278d4e795
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fb7d918ea8d0fa3c21d170c26841574
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e723a9f8838f13157caca81678a800c |
| publicationDate |
2008-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200849506-A |
| titleOfInvention |
Connection structure for flip-chip semiconductor package, build-up layer material, sealing resin composition, and circuit substrate |
| abstract |
A connection structure for a flip-chip semiconductor package is provided. The structure restricts or reduces cracking or detachment and thereby enhances reliability. The structure increases the degree of freedom in designing an inner-layer circuit of a circuit substrate and thereby decreases inductance. The structure comprises a circuit substrate with a core layer and a build-up layer, a semiconductor element connected to the circuit substrate via a metal bump, and a sealing resin composition sealedly disposed between the semiconductor element and the circuit substrate. Hardened article of the sealing resin composition has a glass transition temperature between 80 and 150 DEG C and a coefficient of linear expansion between 15 and 35ppm/ DEG C from room temperature to the glass transition temperature. Hardened article of the build-up layer has a glass transition temperature above 170 DEG C and a coefficient of linear expansion below 40ppm/ DEG C in the planar direction at temperature below the glass transition temperature. A stacked via is formed in the build-up layer on at least one side of the core layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I737851-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I774640-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I763288-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11040517-B2 |
| priorityDate |
2007-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |