http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200848928-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-029 |
| filingDate | 2008-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d440d033ae0157466be2cebc09a5df7e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b0347dd9491ca2c698cbe7a4127f64c |
| publicationDate | 2008-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200848928-A |
| titleOfInvention | Radiation-sensitive resin composition |
| abstract | A radiation-sensitive resin composition comprising (A) an alkali-soluble copolymer, (B) a compound with ethylenically unsaturated double bond, and (C) a radiation-sensitive radical polymerization initiator containing any of compounds of the following formula (1) and any of compounds of the following formula (2). This radiation-sensitive resin composition realizes excellent image resolution, excellence in adherence with substrates, plating solution wettability and plating resistance, and excellence in the detachability of hardened film after formation of desired plating shaped form from the substrate, and thus is suitable for use as a material for bump formation and wiring formation. |
| priorityDate | 2007-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 274.