http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200848544-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f8c68b948c6edd96efe428d7c9748d9 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-54 |
| filingDate | 2007-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_041c58127aecbc5c52aa396fc7a1be46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9be67ed0549af8e315646bd51984636 |
| publicationDate | 2008-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200848544-A |
| titleOfInvention | Electroless golden plating bath without cyanide |
| abstract | The present invention relates to an electroless golden plating bath without cyanide. In particular, gold ions in the golden plating bath are stably positively deposited on the surface of a metal substrate with a high adhesion and uniform plating width. The electroless golden plating bath comprises at least one water-soluble gold compound, at least one gold complexing agent, at least one reducing agent, at least one metal ion or element, and at least one carboxyl compound or salt thereof to quickly plate gold on the surface of metal substrate and form a complete shape at the plating position. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I404823-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104520471-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104520471-A |
| priorityDate | 2007-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 80.