http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200846430-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d3082cd39bb800686b9abbb8aa05c80b
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
filingDate 2007-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c3c1c080881a1104494e6ba22fad68a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2acfc2895db4a97b9562f93a63122558
publicationDate 2008-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200846430-A
titleOfInvention Glass polishing compositions and methods
abstract The present invention provides glass polishing compositions and methods suitable for polishing a glass substrate at a down force of 110 g/cm2 or less. One preferred polishing composition comprises a particulate cerium oxide abrasive (e.g., 1 to 15 percent by weight) suspended in an aqueous carrier containing a polymeric stabilizer, e.g., 50 to 1500 ppm of the stabilizer, and optionally, a water soluble inorganic salt. Preferably, the particulate cerium oxide abrasive has a mean particle size in the range of 0.35 to 0.9 μm. Another preferred composition comprises 1 to 15 percent by weight of a particulate cerium oxide abrasive characterized by a mean particle size of at least 0.2 μm and a purity of at least 99.9% CeO2, on a weight basis, suspended in an aqueous carrier at a pH at least 1 unit higher or lower than the isoelectric point (IEP) of the cerium oxide abrasive.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114479676-A
priorityDate 2007-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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