http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200846412-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00 |
| filingDate | 2008-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57003384f6b234c192e0cc572ca914ab http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06e49c4357ba9a177f5e381a5f0d41bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e35a46f85b3e2b946ac3edf1cabaa65 |
| publicationDate | 2008-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200846412-A |
| titleOfInvention | Thermosetting resin composition and method for manufacturing printed circuit substrate using the same |
| abstract | To provide a thermosetting resin composition, wherein the composition is filled in a hole and a depression in a printed wiring board, and removal of unnecessary parts after thermosetting the composition can be performed not by physical treatment but by chemical treatment, and to provide a method for manufacturing a printed wiring board and a printed wiring board. The thermosetting resin composition comprises, as essential ingredients, (A) an epoxy resin having two or more epoxy groups in a molecule, (B) a resin having a urethane bond which can easily be decomposed by an oxidizing agent, particularly, a polyimide resin which has a carboxyl group or an acid anhydride group and has a linear hydrocarbon structure with a number average molecular weight of 700-6,000, c an epoxy curing agent, and (D) a filler. This composition is filled in a hole such as a plating through hole 2 and a depression between conductor circuit layers 3 in a printed wiring board 1, thermally cured, and then subjected to oxidizing agent treatment to remove a surface part of the cured composition layer to expose a conductor circuit pattern and make the surface of the board flat. |
| priorityDate | 2007-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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