| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D10B2101-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T442-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D10B2321-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0278
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D10B2401-041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D10B2401-063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D10B2505-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T442-2475
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2353-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4626
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D10B2321-021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D10B2321-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0158 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D03D15-283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D03D15-573
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D03D15-587
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D03D15-47
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D03D15-267
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B11-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/D03D1-0082 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2008-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ebee93f7fa02f183efb35b4c6282f59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b892c40ce5d12129cadda4a9290bb8f0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_274c5e7360975fa9c7b08f7313276064 |
| publicationDate |
2008-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200846398-A |
| titleOfInvention |
Prepreg, multilayer printed wiring board and electronic parts using same |
| abstract |
The purpose of the invention is to provide a wiring plate material without processability deterioratg plate material without processability deterioration which reduces dielectric loss tangent, weight ion which reduces dielectric loss tangent, weight and cost and is corresponding to high frequency. Aand cost and is corresponding to high frequency.; And the invention provides a prepreg of resin compond the invention provides a prepreg of resin composition comprising dipping thermosetting low dielecsition comprising dipping thermosetting low dielectric loss tangent in the substrate combined by poltric loss tangent in the substrate combined by polyolefine fiber and high strength fiber and an elecyolefine fiber and high strength fiber and an electronic part formed by the condensate as insulated tronic part formed by the condensate as insulated layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I477208-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10793716-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I464213-B |
| priorityDate |
2007-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |