| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_10cfc10171f0e204339e96e62a544ce0 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate |
2008-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_100e7d526cf8ae65dd50698a5c9a49b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3118ef266ae55ee177a4b1c3921a70ac |
| publicationDate |
2008-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200844197-A |
| titleOfInvention |
Polishing composition |
| abstract |
To provide a polishing composition whose dishing is suppressed and which is polished at high speed. The polishing composition is suitable for a metal film, especially a copper (Cu) film, and it comprises ammonia, ammonium salt, hydrogen peroxide and amino acid. A remaining part is water. Ammonium chloride and ammonium carbonate are desirable as ammonium salt. Acidic amino acid and hydroxy amino acid are desirable as amino acid. |
| priorityDate |
2007-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |