Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d380ea394238f732e0ab98fa00bad429 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-407 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-42368 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66734 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-1095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7806 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7813 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-265 |
filingDate |
2008-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf913d0a04bcd9bf01e0990ee9f4cf12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f872c60ee19086d18ea61aefe90c8ff7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f3d973a1576a5b7253446f157079ef0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f776a60d9467280820232879593226b1 |
publicationDate |
2008-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-200843113-A |
titleOfInvention |
Device structure and manufacturing method using HDP deposited source-body implant block |
abstract |
This invention discloses a semiconductor power device. The trenched semiconductor power device includes a trenched gate, opened from a top surface of a semiconductor substrate, surrounded by a source region encompassed in a body region near the top surface above a drain region disposed on a bottom surface of a substrate. The semiconductor power device further includes an implanting-ion block disposed above the top surface on a mesa area next to the body region having a thickness substantially larger than 0.3 micron for blocking body implanting ions and source ions from entering into the substrate under the mesa area whereby masks for manufacturing the semiconductor power device can be reduced. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8791002-B2 |
priorityDate |
2007-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |