| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0665 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate |
2008-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26033f77fac929af54539a4037fc7aab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f25ecd782c46789a0c771c686e04c26b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f7cc6a6ada56903a09e0d7c62404f44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d758a4d3a62625bf8472668efacb6cdf |
| publicationDate |
2008-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200842957-A |
| titleOfInvention |
Dicing/die bonding tape and method for manufacturing semiconductor chip |
| abstract |
This invention provides a dicing/die bonding tape which, in dicing of a semiconductor wafer followed by pick-up of a semiconductor chip together with a die bonding film, can realize easy separation and taking-out of the semiconductor chip together with the die bonding film. The dicing/die bonding tape is a dicing/die bonding tape (1) for use in a process, in which a semiconductor wafer is diced to provide a semiconductor chip which is then die bonded. The dicing/die bonding tape (1) comprises a die bonding film (3) and a nonpressure-sensitive adhesive film (4) applied onto one side of the die bonding film (3). The nonpressure-sensitive adhesive film (4) comprises a crosslinked product of an (meth)acrylic resin as a main component. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I485756-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9305769-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8871609-B2 |
| priorityDate |
2007-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |