http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200842135-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fce5ff40c7ed9aa6caebe463c9d48a6c |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3218 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
filingDate | 2007-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b37288539460b7d5ee86b88b765472e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b704ea5397d20fa2fc6f24515e48ea3f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_398b4054067aa3788d0554bb7a1ec8dd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed1ee6b63434b316ce0bfbfc8d77217b |
publicationDate | 2008-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-200842135-A |
titleOfInvention | Flame retardant resin composition |
abstract | A flame retardant resin composition comprises: (A) one or more epoxy resins having biphenylic units or naphthalenic units; (B) a phenolic resin as a curing agent, which contains one or more phenolic resins with biphenylic moieties and polyphenolic moieties, the total amount of the phenolic resins having biphenylic moieties and polyphenolic moieties is 30-100% by weight of the curing agent; (C) a curing accelerator; and (D) an inorganic filler. The flame retardant resin composition, by using epoxy resins having biphenylic units or naphthalenic units and using phenolic resins having biphenylic moieties and polyphenolic moieties as the curing agent, may reach excellent flame retardancy without adding flame retardants and has higher glass transition temperature, may improve the problem of water absorption after cure of resin composition and enhance heat resistance. Therefore, this flame retardant resin composition is especially suitable for manufacturing composite materials as molding materials or semiconductor packaging materials. |
priorityDate | 2007-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 135.