http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200840429-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5dabfc7998cca69e04571256e5cb4e80 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2007-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e09b572cd60b19ce8c7a12ff8f613e0 |
| publicationDate | 2008-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200840429-A |
| titleOfInvention | Circuit board structure having buffer layer and method for fabricating the same |
| abstract | A circuit board structure having a buffer layer is disclosed. The structure comprises a circuit board and a buffer layer. The surface of the circuit board includes a plurality of conductive pads and a solder mask. The solder mask has a plurality of openings to expose the conductive pads. The buffer layer corresponds to the conductive pads and is disposed inbetween the conductive pads and the surface of the circuit board. The present invention further comprises a method for fabricating the same. The buffer layer of the present invention has a buffer effect to avoid the break-down of the electricity of the circuit board structure. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I705536-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I476844-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106973496-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113022046-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106973496-A |
| priorityDate | 2007-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.