| abstract |
The present invention relates to an epoxy resin composition for encapsulating a semiconductor, characterized by comprising an epoxy resin (A) containing a crystalline epoxy resin (a1) with a melting point of 50-150 DEG C, an epoxy resin (a2) represented by the formula (1), and an epoxy resin (a3) selected from at least one of the epoxy resins represented by the formulae (2) and (3). In the formulae (1)-(3), R1 can be the same or different and represents a hydrocarbon group having 1-4 carbon atoms, R2 can be the same or different and represents hydrogen or a hydrocarbon group having 1-4 carbon atoms, m is an integer of 0-5, and n is an integer of 0-6. |