| abstract |
A thermosetting resin composition which comprises (A) a hardener having an acid substituent and an unsaturated maleimide group and produced by a specific process, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin having a specific monomer unit, and (D) an epoxy resin; a prepreg containing the composition; and a laminate produced with the composition. The thermosetting resin composition has a good balance among all of adhesion to metal foils, heat resistance, moisture resistance, flame retardancy, heat resistance in the state of being adherent to metals, relative permittivity, and dielectric dissipation factor. It is lowly toxic and is excellent in safety and working environment. The thermosetting resin composition can hence be used to give a prepreg and laminate having excellent performances. |