http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200836278-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_58d747a758244f04750caa191d6bb879 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
filingDate | 2007-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_704640f1ab2ef0f2f6f7ee65bdb04a13 |
publicationDate | 2008-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-200836278-A |
titleOfInvention | Non-cyanogen-based gold electroplating bath for forming gold bump or gold wiring |
abstract | The present invention relates to the gold bump used as the electrode of semiconductor chip or non-cyanogen-based gold electroplating bath used to form the gold wiring. The electroplating bath is capable of solving depressions on a gold plating film generated by a passivation level difference, and attaining sufficient adhesive strength of gold electroplating film during package of semiconductor chip. The non-cyanogen-based gold electroplating bath for forming gold bump or gold wiring of the present invention comprises: 1-20 g/l of the alkali salt of gold sulfite or ammonium gold sulfite as a gold source; 1-30 g/l water soluble amine; the Ti, Pb, or As compound by 0.1 to 100 mg/L as metal concentration; 5-100 g/L of sulfite as a SO3-2 source and 1-120 g/L of sulfate as SO4-2 source; and a 0.1-30 g/L of buffer, and further comprises: one or more salts selected from the salts of palladium, platinum, zinc and silver by 0.1 to 100 mg/L as metal concentration. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I513864-B |
priorityDate | 2006-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 82.