| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_01e48e78fadaaec045333f9ad5a6e0b5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B38-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1189
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1972
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B17-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B43-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1168
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-19 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J109-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J115-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J165-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate |
2007-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6f89595bee6288612732d2cee7e532c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7628ad5950b0db314938d71c3aa6f6d5 |
| publicationDate |
2008-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200834795-A |
| titleOfInvention |
High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach |
| abstract |
New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a polymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I494398-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I496857-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8771442-B2 |
| priorityDate |
2006-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |