http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200834762-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_df6a7983dd4e616c5af8ad4e3e827006 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2007-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ddeb8968ff8fa36be17d285bf48666d |
| publicationDate | 2008-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200834762-A |
| titleOfInvention | Flat-bump structure and manufacturing method therefore |
| abstract | A method for manufacturing a flat-bump structure is provided. A substrate is provided, and the substrate has a plurality of pads and a passivation layer, wherein the passivation layer has a plurality of first openings exposing. A portion of each of the pads is exposed by the first opening, respectively. A under ball metal (UBM) material layer is formed over the substrate to cover the passivation and the pads exposed by the passivation. A plurality of flat-bumps is formed on the UBM material layer over the pads exposed by the passivation, wherein the lower area of each of flat-bumps is smaller than the lower area of first opening, respectively. The upper surface of the flat-bump is plane surface. The UBM material layer is patterned to form a plurality of UBM layers, wherein the lower area of each of UBM layers is larger than the lower area of first opening, respectively. Therefore, the flat-bump has a planar upper surface. |
| priorityDate | 2007-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 17.