| abstract |
There is provided an electroplating method in which metallic substrate dissolution is prevented and electroplating is normally done even on a very thin metallic substrate, when electroplating is done on surface of metallic substrate. When electroplating is done on surface of metallic substrate, electroplate is done by meaw of induced eutectoid under the supercritical or subcritical state which contains at least one of carbon dioxide and inert gases, electroplating liquid with dispersed metal powder and surfactants. Metallic concentration in electroplating liquid becomes saturation or supersaturation state, so dissolving rate of metallic substrate can be inhibited, as well as induced eutectoid is used to obtain electroplating layer with smooth surface in short time. Even if metallic substrate is consiste of metallic film formed on the surface of insulating film which is installed on the substrate, or if said metal is supper, zinc, iron or cobalt, the electroplating method of the present invention is suitable. |