http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200831283-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-27 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0358 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-265 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-00 |
| filingDate | 2007-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ce92ede0c06cbf5379916c9304e9832 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe2fdc69dacf2edbcbc23ed2536c664f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee3a3dfd23026ed4e112b3fdf29b4576 |
| publicationDate | 2008-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200831283-A |
| titleOfInvention | Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated copper foil with very thin primer resin layer |
| abstract | This invention provides a surface treated copper foil which, without use of chromium in an antirust treated layer in an electrolytic copper foil, is excellent in good properties after fabrication into a printed wiring board, for example, in peel strength of a circuit and the percentage deterioration in chemical resistance regarding the peel strength. In the surface treated copper foil, an antirust treated layer and a silane coupling agent layer are provided on a face of lamination of an electrolytic copper foil onto an insulating resin base material. The surface treated copper foil is characterized in that the antirust treated layer comprises a nickel alloy layer having a weight thickness of 5 mg/m2 to 50 mg/m2 and a tin layer having a weight thickness of 5 mg/m2 to 40 mg/m2 stacked in that order and a silane coupling agent layer is provided on the surface of the antirust treated layer. Further, the present invention further provides, for example, a surface treated copper foil with a very thin primer resin layer, characterized in that a very thin primer resin layer having an equivalent thickness of 1 μm to 5 μm is provided on a face of lamination of the surface treated copper foil (not subjected to roughening treatment) on the insulating resin base material. |
| priorityDate | 2006-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 125.