| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c62cde03192748a8ed36c2a5b6b1c608 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06575
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-0651 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 |
| filingDate |
2007-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c19e81e2c3f1ef0a245e68498374f50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7835cddb7263d07cdc6d2da430811e16 |
| publicationDate |
2008-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200830526-A |
| titleOfInvention |
Stacked-chip package structure |
| abstract |
A stacked-chip package structure is provided, the package structure utilizing an adhesive layer to sustain the upper chip and to protect the bonding wires of the lower chip from compression. Moreover, the adhesive layer can decrease the depth of the package and reduce the production cost. |
| priorityDate |
2007-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |