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publicationDate 2008-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200830428-A
titleOfInvention Forming reverse-extension metal-oxide-semiconductor device in standard CMOS flow and method for forming thereof
abstract A metal-oxide-semiconductor device, semiconductor device and a method for forming the same are provided. The semiconductor device includes a gate dielectric over a semiconductor substrate, a gate electrode on the gate dielectric, a lightly doped drain/source (LDD) region in the semiconductor substrate and having a portion extending under the gate the electrode, a deep source/drain region in the semiconductor substrate, and an embedded region enclosed by a top surface of the semiconductor substrate, the LDD region, and the deep source/drain region. The embedded region is of a first conductivity type, and the LDD region and the deep source/drain region are of a second conductivity type opposite the first conductivity type. The embedded region and the LDD region are preferably formed simultaneous1y with the formation of a LDD region and a pocket region of an additional MOS device, respectively.
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