http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200830414-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32139 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66765 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-786 |
| filingDate | 2007-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08c3c208a19249aed913b9f5a0c59934 |
| publicationDate | 2008-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200830414-A |
| titleOfInvention | Reflow method, pattern-forming method, and method for manufacturing TFT |
| abstract | To provide a reflow method capable of expediting the fluidization of a resist to improve throughput in reflow treatment and adjusting the treatment speed of reflow in the plane of a workpiece. Prior to reflow treatment in step a S7, UV irradiation treatment is locally executed in a step S6. The UV irradiation treatment reforms the surface of a lower film not covered with a source electrode resist mask 210 and a drain electrode resist mask 211 to bring the resist in a fluidizable state in reflow treatment to be subsequently executed. Thus, the reflow treatment can be finished in a shorter process time and the fluidization speed of the resist can be adjusted in the plane of the substrate. |
| priorityDate | 2006-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.