http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200830047-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00 |
filingDate | 2007-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_453388cc8a7b6a8edf9017a251afc1ab http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6241b5a92d9cc988f08c4bc1ca1ad60b |
publicationDate | 2008-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-200830047-A |
titleOfInvention | Photocurable thermosetting resin composition and printed wiring board using the same |
abstract | To provide a white photocurable/thermosetting resin composition forming a high-reflectance solder resist film when used as a solder resist, and accurately forming a pattern latent image upon irradiation with light, and a printed wiring board having a high-reflectance solder resist film formed using the white photocurable/thermosetting resin composition. The white photocurable/thermosetting resin composition comprises (A) a carboxylic resin having no aromatic ring, (B) a photopolymerization initiator comprising at least one oxime ester photopolymerization initiator, (C) an epoxy compound, (D) rutile type titanium dioxide and (E) a diluent. The printed wiring board is obtained by forming a solder resist film using the white photocurable/thermosetting resin composition. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I381202-B |
priorityDate | 2006-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 115.